inline-defaultCreated with Sketch.

This website uses cookies to ensure you get the best experience on our website.

Students
Tuition Fee
GBP 28,950
Per year
Start Date
Medium of studying
Duration
12 months
Program Facts
Program Details
Degree
Masters
Major
Computer Engineering | Systems Design | Technology
Area of study
Information and Communication Technologies
Timing
Full time
Course Language
English
Tuition Fee
Average International Tuition Fee
GBP 28,950
Intakes
Program start dateApplication deadline
2024-09-01-
About Program

Program Overview


The Microelectronics: Systems and Devices MSc program equips students with advanced knowledge and practical skills in microelectronics, preparing them for careers in VLSI circuit and system design, electronic device engineering, embedded systems development, and AI hardware integration. Through a blend of lectures, labs, and research projects, students gain expertise in cutting-edge technologies and industry-standard design tools. Graduates have secured positions in leading companies and pursued further studies in microelectronics-related fields.

Program Outline


Degree Overview:


Aims and Objectives:

The Microelectronics: Systems and Devices MSc aims to equip students with advanced knowledge and practical skills in microelectronics, preparing them for successful careers in this dynamic industry. The program emphasizes:

  • Cutting-edge VLSI circuit and system design
  • Advanced electronic device engineering
  • Development of real-time embedded systems
  • Integration of microelectronic devices with AI hardware and applications
  • Advanced research and development in microelectronics-related fields

Program Description:

This postgraduate program is designed for graduates with a background in electrical and electronic engineering, computer engineering, applied physics, or related disciplines. It equips them with theoretical knowledge and practical expertise through:

  • A blend of lectures, tutorials, seminars, practical lab sessions, research projects, group work, and independent study.
  • Access to state-of-the-art facilities, including advanced clean-room fabrication and characterisation equipment, and involvement in research collaborations with industry.
  • Individual research project on relevant topics for practical application and development of research skills.
  • The program is delivered through a combination of individual modules and a research-based Individual Project.

Outline:


Structure:

  • Credits: 180
  • Duration: 12 months (full-time)
  • Start date: September

Modules:


Compulsory Modules (20 credits each):

  • Real-Time Embedded Systems
  • Individual Project (60 credits)
  • Advanced Electronic Devices
  • Low-Power VLSI Design
  • Advanced Device Fabrication
  • Microelectronics Design Tools
  • Research Skills and Development for Engineers

Optional Modules:

  • VLSI Circuit Design Techniques
  • High-Speed Circuits and Systems
  • Low-Power Digital Circuit Design
  • Design of Nanostructured Devices
  • Memristor Devices and Applications
  • Electronic Design Automation for Nanometer Design
  • High-Level Synthesis
  • Power Management Circuits

Individual Modules Description:


Real-Time Embedded Systems:

Explore concepts and theories like embedded designs, real-time scheduling, concurrent models, interfaces, and real-time interfaces (ACM). Gain knowledge and hands-on experience with reconfigurable hardware platforms like FPGA-based microchips.


Individual Project:

Conduct advanced research on a relevant topic, combining knowledge and skills developed throughout the program. Choose from available research areas or propose your own project, culminating in a dissertation with academic supervision.


Advanced Electronic Devices:

Gain understanding of device operation from a physical perspective, including:

  • Semiconductor Physics
  • Heterojunctions
  • Schottky Contacts
  • Metal-Semiconductor and Insulator-Semiconductor Contacts
  • Metal Oxide Semiconductor devices
  • P-N junctions
  • Heterojunction Bipolar Transistors
  • Field Effect Transistors
  • Heterojunction Field Effect Transistors and High Electron Mobility Transistors

Advanced Device Fabrication:

Learn about processes and techniques used in the fabrication of semiconductor devices, covering:

  • Silicon based technologies with MOS structures
  • III-V semiconductors
  • Etching techniques
  • Photolithography
  • Sputtering and thermal evaporation
  • Atomic Layer Deposition
  • Doping techniques and diffusion
  • Wafer cleaning techniques
  • Characterisation and analysis techniques
  • Thin Film Deposition techniques

Microelectronics Design Tools:

Acquire hands-on experience with industry-standard VLSI design tools for circuit design, simulation, and layout, including Synopsys tools, Cadence tools, and Mentor Graphics tools.


Research Skills and Development for Engineers:

Develop valuable research skills, including:

  • Literature review and summarization
  • Identification and analysis of relevant and irrelevant materials
  • Problem analysis and formulation
  • Planning and organization strategies

Assessment:


Assessment methods:

  • Written examinations
  • Coursework
  • Projects
  • Dissertation
  • Oral examinations
  • Oral presentations
  • Reports

Assessment criteria:

  • Demonstration of knowledge and understanding of key concepts and theories
  • Critical thinking and analysis skills
  • Effective communication skills
  • Project management and research skills

Teaching:


Delivery and teaching methods:

  • Lectures
  • Tutorials
  • Seminars
  • Practical lab sessions
  • Research projects
  • Group work
  • Independent study
  • Computing workshops

Teaching staff:

  • Senior academics with expertise in microelectronics and related fields
  • Industry experts from collaborating companies

Approaches:

  • Multidisciplinary approach to teaching, engaging students with diverse engineering disciplines and industry experts
  • Project-based learning with access to state-of-the-art facilities
  • Active learning through tutorials and seminars

Careers:


Potential career paths:

  • VLSI design engineers
  • Microelectronics engineers
  • Semiconductor research scientists
  • Embedded systems engineers
  • AI hardware engineers
  • Applications engineering roles in microelectronics companies

Opportunities and outcomes:

  • Graduates have secured positions in leading companies including Arm, Intel, Huawei, Infineon, Cadence, Synopsys, Google, and Microsoft.
  • Some graduates continue their studies through PhDs in various research areas within microelectronics and related fields.

Other:

  • The program is professionally accredited by the Engineering Council and the Institution of Engineering and Technology (IET).
  • Students have access to a wide range of dedicated specialist facilities in the School of Engineering and across campus to support their studies.
SHOW MORE
How can I help you today?